Publication:
Layout Considerations for 2D Planar Waveguide OXC with Integrated Lens Pair
Layout Considerations for 2D Planar Waveguide OXC with Integrated Lens Pair
dc.contributor.author | Kwok, Chee | en_US |
dc.contributor.author | Mackenzie, Mark | en_US |
dc.contributor.author | Peng, Gang-Ding | en_US |
dc.date.accessioned | 2021-11-25T14:38:44Z | |
dc.date.available | 2021-11-25T14:38:44Z | |
dc.date.issued | 2003 | en_US |
dc.description.abstract | This paper reports on the scalability of MEMS optical cross-connect (OXC) switches which use 2D planar waveguide architecture and an integrated waveguide lens to enhance free space propagation. The optical loss, total device area and ease of integration with MEMS micromirrors are considered for three competing layout configurations. | en_US |
dc.identifier.uri | http://hdl.handle.net/1959.4/43064 | |
dc.language | English | |
dc.language.iso | EN | en_US |
dc.publisher | SPIE - The International Society for Optical Engineering | en_US |
dc.rights | CC BY-NC-ND 3.0 | en_US |
dc.rights.uri | https://creativecommons.org/licenses/by-nc-nd/3.0/au/ | en_US |
dc.source | Legacy MARC | en_US |
dc.title | Layout Considerations for 2D Planar Waveguide OXC with Integrated Lens Pair | en_US |
dc.type | Conference Paper | en |
dcterms.accessRights | open access | |
dspace.entity.type | Publication | en_US |
unsw.accessRights.uri | https://purl.org/coar/access_right/c_abf2 | |
unsw.description.notePublic | Kwok, CY., Mackenzie, MR. & Peng, G., "Layout considerations for 2D planar waveguide OXC with integrated lens pair," Photonics: Design, Technology, and Packaging , Chennupati Jagadish, Kent D. Choquette, Benjamin J. Eggleton, Brett D. Nener, Keith A. Nugent (eds), 5277, 215, (2004). | en_US |
unsw.description.publisherStatement | Copyright 2003 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. | en_US |
unsw.identifier.doiPublisher | http://dx.doi.org/10.1117/12.523233 | en_US |
unsw.publisher.place | USA | en_US |
unsw.relation.faculty | Engineering | |
unsw.relation.ispartofconferenceLocation | Perth, Australia | en_US |
unsw.relation.ispartofconferenceName | Photonics: Design, Technology & Packaging | en_US |
unsw.relation.ispartofconferenceProceedingsTitle | Proceedings of Photonics: Design, Technology & Packaging | en_US |
unsw.relation.ispartofconferenceYear | 2003 | en_US |
unsw.relation.ispartofpagefrompageto | 215-222 | en_US |
unsw.relation.originalPublicationAffiliation | Kwok, Chee, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW | en_US |
unsw.relation.originalPublicationAffiliation | Mackenzie, Mark, Faculty of Engineering, UNSW | en_US |
unsw.relation.originalPublicationAffiliation | Peng, Gang-Ding, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW | en_US |
unsw.relation.school | School of Electrical Engineering and Telecommunications | * |
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