A deep level transient spectroscopy (DLTS) study of defects created by low-fluence, low-energy ion-implantation for development of ion-implanted silicon field-effect transistors for spin-dependent transport experiments is presented. Standard annealing strategies are considered to activate the implanted dopants and repair the implantation damage in test metal-oxide-semiconductor (MOS) capacitors. Fixed oxide charge, interface trapped charge and the role of minority carriers in DLTS are investigated. A furnace anneal at 950 °C was found to activate the dopants but did not repair the implantation damage as efficiently as a 1000 °C rapid thermal anneal. No evidence of bulk traps was observed after either of these anneals. The ion-implanted spin-dependent transport device is shown to have expected characteristics using the processing strategy determined in this study.