Publication:
Fabrication of integrated lens pair test device
Fabrication of integrated lens pair test device
dc.contributor.author | Kwok, Chee | en_US |
dc.contributor.author | Mackenzie, Mark | en_US |
dc.contributor.author | Peng, Gang-Ding | en_US |
dc.date.accessioned | 2021-11-25T14:38:04Z | |
dc.date.available | 2021-11-25T14:38:04Z | |
dc.date.issued | 2004 | en_US |
dc.description.abstract | A silica microlens has been proposed which can be integrated with planar optical waveguide circuits. In order to fabricate the microlens, two deep silica etches must be performed. RIE is the prefered process as under certain conditions it is anisotropic. This paper reports on a study of different masking materials and plasma etch conditions trialed for the deep silica etch. | en_US |
dc.identifier.uri | http://hdl.handle.net/1959.4/43052 | |
dc.language | English | |
dc.language.iso | EN | en_US |
dc.publisher | SPIE - The International Society for Optical Engineering | en_US |
dc.rights | CC BY-NC-ND 3.0 | en_US |
dc.rights.uri | https://creativecommons.org/licenses/by-nc-nd/3.0/au/ | en_US |
dc.source | Legacy MARC | en_US |
dc.title | Fabrication of integrated lens pair test device | en_US |
dc.type | Conference Paper | en |
dcterms.accessRights | open access | |
dspace.entity.type | Publication | en_US |
unsw.accessRights.uri | https://purl.org/coar/access_right/c_abf2 | |
unsw.description.notePublic | Kwok, CY., Mackenzie, MR. & Peng, G., "Fabrication of integrated lens pair test device," Proc. SPIE - Smart Structures, Devices, and Systems II, Said F. Al-Sarawi (ed.), 5649 (Waveguides), 180, (2005). | en_US |
unsw.description.publisherStatement | Copyright 2004 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. | en_US |
unsw.identifier.doiPublisher | http://dx.doi.org/10.1117/12.582391 | en_US |
unsw.publisher.place | USA | en_US |
unsw.relation.faculty | Engineering | |
unsw.relation.ispartofconferenceLocation | Sydney, Australia | en_US |
unsw.relation.ispartofconferenceName | International symposium on smart materials, nano- and micro-smart systems | en_US |
unsw.relation.ispartofconferenceProceedingsTitle | Smart structures, devices, and systems II | en_US |
unsw.relation.ispartofconferenceYear | 2004 | en_US |
unsw.relation.ispartofpagefrompageto | 180-185 | en_US |
unsw.relation.originalPublicationAffiliation | Kwok, Chee, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW | en_US |
unsw.relation.originalPublicationAffiliation | Mackenzie, Mark, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW | en_US |
unsw.relation.originalPublicationAffiliation | Peng, Gang-Ding, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW | en_US |
unsw.relation.school | School of Electrical Engineering and Telecommunications | * |
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