Publication:
Fabrication of integrated lens pair test device

dc.contributor.author Kwok, Chee en_US
dc.contributor.author Mackenzie, Mark en_US
dc.contributor.author Peng, Gang-Ding en_US
dc.date.accessioned 2021-11-25T14:38:04Z
dc.date.available 2021-11-25T14:38:04Z
dc.date.issued 2004 en_US
dc.description.abstract A silica microlens has been proposed which can be integrated with planar optical waveguide circuits. In order to fabricate the microlens, two deep silica etches must be performed. RIE is the prefered process as under certain conditions it is anisotropic. This paper reports on a study of different masking materials and plasma etch conditions trialed for the deep silica etch. en_US
dc.identifier.uri http://hdl.handle.net/1959.4/43052
dc.language English
dc.language.iso EN en_US
dc.publisher SPIE - The International Society for Optical Engineering en_US
dc.rights CC BY-NC-ND 3.0 en_US
dc.rights.uri https://creativecommons.org/licenses/by-nc-nd/3.0/au/ en_US
dc.source Legacy MARC en_US
dc.title Fabrication of integrated lens pair test device en_US
dc.type Conference Paper en
dcterms.accessRights open access
dspace.entity.type Publication en_US
unsw.accessRights.uri https://purl.org/coar/access_right/c_abf2
unsw.description.notePublic Kwok, CY., Mackenzie, MR. & Peng, G., "Fabrication of integrated lens pair test device," Proc. SPIE - Smart Structures, Devices, and Systems II, Said F. Al-Sarawi (ed.), 5649 (Waveguides), 180, (2005). en_US
unsw.description.publisherStatement Copyright 2004 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. en_US
unsw.identifier.doiPublisher http://dx.doi.org/10.1117/12.582391 en_US
unsw.publisher.place USA en_US
unsw.relation.faculty Engineering
unsw.relation.ispartofconferenceLocation Sydney, Australia en_US
unsw.relation.ispartofconferenceName International symposium on smart materials, nano- and micro-smart systems en_US
unsw.relation.ispartofconferenceProceedingsTitle Smart structures, devices, and systems II en_US
unsw.relation.ispartofconferenceYear 2004 en_US
unsw.relation.ispartofpagefrompageto 180-185 en_US
unsw.relation.originalPublicationAffiliation Kwok, Chee, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW en_US
unsw.relation.originalPublicationAffiliation Mackenzie, Mark, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW en_US
unsw.relation.originalPublicationAffiliation Peng, Gang-Ding, Electrical Engineering & Telecommunications, Faculty of Engineering, UNSW en_US
unsw.relation.school School of Electrical Engineering and Telecommunications *
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