Operational Amplifier Characteristics in the Extreme Sub-Micron Process

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Copyright: Yang, Edward
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Abstract
Newer CMOS technologies allow for circuits to poses higher frequency performance, lower power consumption, reduced cost per transistor, and smaller layout area. Digital circuits greatly benefit from the use of newer CMOS technologies, but analogue circuits do not. In more modern CMOS technologies, the transconductance and output resistance of a transistor decrease, to which these two parameters serve as the foundation for developing high-performance analogue circuitry. The manufacturing process defines the transconductance of a transistor, but circuit techniques can make a transistor to seem like it has higher output resistance. The development and verification of a 22nm FDSOI CMOS op-amp and it’s supporting characterising circuit (the OPCC) are the two goals of this thesis. The process involves an investigation into various output resistance improve circuit techniques and finding methods to scale the circuit into a 22nm FDSOI CMOS process. A single-stage and a two-stage high-gain op-amp developed in a 22nm FDSOI CMOS process is presented. Two hundred runs of Monte Carlo simulations, which include transistor mismatch and process variation, validates the operation of the two op-amps. The integration of a modified high output resistance current mirror allows the op-amp to achieve high DC gains. The two-stage op-amp can perform rail-to-rail operations with a 800mV power supply voltage while driving a 1 pF capacitive load. The single-stage op-amp is simulated to have a 69 dB minimum DC gain, 29MHz UGB, with a PM of 86°. The two-stage op-amp is simulated to have a 103 dB minimum DC gain, 50MHz UGB, and a PM of 50°. Sequentially, a 22nm CMOS on-chip digitally controlled op-amp characterisation circuit is presented. The conversion of old on-chip and breadboard- based op-amp characterisation methods are scaled to the 22nm FDSOI CMOS process to enable the measurement of op-amps that are designed for on-chip use. Advancements in CMOS manufacturing process reduce the performance of transmission gates, to which, methods to mitigate the reduction in performance are elaborated. The OPCC enables the measurement of offset voltage with max SD of 0.1mV, input bias currents with max SD of 15.7pA, bandwidth with max SD of 1.73MHz, open-loop gain with max SD of 0.4 dB, CMRR with max SD of 8.774 dB, and PSRR with max SD of 1.1dB. Four hundred runs of Monte Carlo simulations validate the operations of the OPCC, which also indicates its potential implementation in older CMOS technologies.
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Publication Year
2019
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Thesis
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Masters Thesis
UNSW Faculty
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